Intel and UMC collaborate to develop 12nm process
Intel and UMC Announce New Foundry Collaboration :: Intel Corporation (INTC)
🟦 Intel and UMC Announce Strategic Partnership to Develop New Semiconductor Process in Arizona
Intel and UMC have teamed up to sign a long-term agreement to develop a 12nm semiconductor process platform. The new 12nm process will be developed in Arizona and is expected to go into production in 2027. According to Intel’s Stuart Pang, the collaboration is part of bringing technology and manufacturing innovation to the global semiconductor supply chain and is an important step in Intel’s goal to become the world’s second-largest foundry by 2030.
🟦 Intel Expands U.S. Manufacturing Capacity
The 12nm process will be developed for high-growth markets such as mobile, telecommunications infrastructure, and networking. UMC in Taiwan is the world’s 4th largest professional foundry manufacturer and focuses on mature processes. UMC’s advanced process is 14nm, but the newly developed 12nm process will enable UMC to serve customers who require more advanced processes than 14nm. Intel, on the other hand, is expected to take advantage of the depreciated process and earn new ones. In addition, Intel’s enhancement of manufacturing capabilities in the U.S. is expected to contribute to the stabilization of supply chains.
🟦Summary
Intel and UMC have signed a long-term agreement to develop the 12nm process. The new process, which is expected to go into production in 2027, will focus on product development in high-growth markets such as mobile and telecommunications infrastructure.
Intel’s mature 12nm process is used as the advanced process for UMC, and it is a mutually beneficial relationship. 12nm is a cutting-edge technology for semiconductor manufacturing in Japan, and there is a possibility that similar efforts can be made.
