企業分析 🟦 SoftBank to invest 3 billion yen in next-generation memory development In anticipation of the advent of the AI inference era, SoftBank has announced its intention to invest 3 billion yen in t... 2025.05.13 企業分析
企業分析 🟦CISSOID and EDAG join forces to develop next-generation SiC inverters and evolve the heart of EVs! CISSOID and EDAG have formed a strategic alliance to accelerate the development of next-generation SiC traction inverter... 2025.05.12 企業分析
企業分析 🟦 Huawei to build advanced semiconductor factory in Shenzhen It has become clear that Huawei is developing its own advanced semiconductor manufacturing base in Shenzhen under the he... 2025.05.10 企業分析
企業分析 🟦 Global semiconductor sales hit record high for March Global semiconductor sales in March 2025 will record 55.9 billion dollars (about 8 trillion yen), a record high for Marc... 2025.05.09 企業分析
企業分析 🟦 Israel Valens and ESWIN Fully Deliver A-PHY Solution for China Valens Semiconductor has partnered with ESWIN Computing in China to accelerate the evolution of the automotive industry'... 2025.05.08 企業分析
企業分析 🟦Silicon wafer shipments of 300mm remained steady, but overall shipments slowed due to inventory adjustments Silicon wafer shipment area in 1Q 2025 increased 2.2% year-on-year, but decreased 9.0% quarter-on-quarter due to invento... 2025.05.04 企業分析
企業分析 🟦 Estonia’s path to becoming a semiconductor design powerhouse with ASICs Estonia has established a semiconductor design support center with an investment of just 2.4 million euros (approximatel... 2025.05.03 企業分析
企業分析 🟦Is Sony considering spinning off its image sensor business? It has been reported that the Sony Group may separate and list its semiconductor subsidiary, and attention is focused on... 2025.05.02 企業分析
企業分析 🟦 Valeo and Appotronics partner on laser diodes! A new attempt to use semiconductor laser technology in automotive headlights has begun: the partnership between Valeo an... 2025.04.29 企業分析
企業分析 🟦 ROHM Transforms the Future of EV Charging with High-Efficiency SiC Modules ROHM announced the new SiC power module "HSDIP20" that combines high efficiency, compactness, and high density for EVs a... 2025.04.27 企業分析