Intel has started production of semiconductors for personal computers using the latest 2-nanometer-class “18A” process at its new plant in Arizona. As an advanced process originating in the United States, Intel aims to return to technology-driven power.
🟧 Intel Starts Production of Semiconductors for PCs in 18A Process
Intel has officially started semiconductor production using a new 2nm-class process “Intel 18A” at its state-of-the-art factory “Fab 52” in Chandler, Arizona, USA.
The first product is “Intel Core Ultra Series 3 (development code name: Panther Lake)“, which is scheduled to be mass-produced from the end of 2025.
- A new transistor structure “RibbonFET” is adopted. The gate all-around structure improves current controllability and switching efficiency, significantly reducing leakage current.
- The world’s first introduction of back-side power supply technology “PowerVia”. By supplying power from the back of the chip, it isolates the signal wiring and reduces noise and power loss.
- Performance and efficiency: Compared to the previous generation “Intel 3”, the performance/power consumption ratio has been improved by approximately 15%, and the chip density has also increased by 30%.
The 18A generation adopts an XPU configuration that integrates CPU, GPU, and AI accelerator, and supports a variety of processing, including AI calculations, on a single chip. In addition to PC applications, the next-generation server Xeon 6+ (Clearwater Forest) will also be produced at the plant.
🟧 Why Intel is rushing mass production at its Arizona plant
In the background, there is a national strategy to regain semiconductor manufacturing sovereignty to the United States. While Taiwan’s TSMC and South Korea’s Samsung plan to mass-produce 2nm, Intel aims to be the only company that can manufacture state-of-the-art nodes in the United States.
In addition, Intel has been slow to acquire customers in recent years in its foundry business (manufacturing chips designed by other companies). The launch of Fab 52 in Arizona is a step forward in the fight against AI demand and the cloud market. While the company is delaying the construction of its plant in Ohio, it is concentrating its resources on Arizona and prioritizing the establishment of mass production technology and yield improvements centered around the 18A.
In the area of manufacturing know-how and quality stability, where TSMC has an advantage, Intel is poised to leverage its advanced packaging technology “Foveros” to achieve both flexibility and high performance through 3D stacking of multiple chiplets.
🟧Summary
Intel’s “18A” process is the first 2-nanometer node to be developed and manufactured in the United States, and is a technology that symbolizes the geopolitical restructuring of the semiconductor industry.
With Fab 52 fully operational, U.S.-origin advanced manufacturing will once again have a strong presence in a wide range of fields, from AI PCs to cloud and robotics.
In the future, it is expected that AI-specialized chips using 18A technology and contract manufacturing projects will expand. 2026 is likely to be the year to measure how far Intel can approach the “miniaturization competition” with TSMC.
