High-performance, low-power semiconductors realized by cutting-edge package technology
🟦 Rapidus and IBM Establish 2nm Generation Semiconductor Chiplet Mass Production Technology
Lapidus and IBM have entered into a partnership to establish mass production technology for chiplet packages for 2nm generation semiconductors. Through this collaboration, Lapidus aims to leverage IBM’s packaging technology for high-performance semiconductors to quickly establish cutting-edge chiplet packaging technology.
Through this partnership, Lapidus will be able to leverage IBM’s technology to develop chiplet packaging technology and contribute to mass production of 2nm generation semiconductors.
🟦 As part of the U.S.-Japan partnership
Lapidus is developing the 2nm process under license from IBM. This is the development of the front-end process in semiconductor manufacturing, and this collaboration to establish chiplet package mass production technology will be a collaboration in the back-end process.
2nm generation semiconductors have higher performance and lower power consumption than conventional semiconductors, and are required in a wide range of fields such as next-generation AI and 5G communications. Chiplet packaging technology is a technology that combines multiple semiconductor chips to achieve higher performance semiconductors. This partnership is part of an international collaboration within the framework of NEDO’s “Development of Chiplet Package Design and Manufacturing Technology for 2nm Generation Semiconductors”.
🟦Summary
Lapidus and IBM have entered into a partnership to establish mass production technology for chiplet packages for 2nm generation semiconductors. Through this collaboration, Lapidus aims to leverage IBM’s packaging technology for high-performance semiconductors to quickly establish cutting-edge chiplet packaging technology.
It may be good to have cooperation not only between Japan and the U.S., but also South Korea, Taiwan, and other countries. It also leads to geopolitical risk diversification.
