Bosch plans to acquire US chipmaker TSI Semiconductors
🟦 Bosch to acquire U.S. semiconductor foundry
Bosch announced that it will acquire TSI Semiconductors, a U.S. foundry. TSI is an application-specific integrated circuit (ASIC) foundry based in Roseville, California. It is a foundry of 200mm wafers primarily for applications in the mobility, telecommunications, energy and life sciences industries.
🟦 Toward a base for SiC power semiconductors in the U.S.
Over the next few years, Bosch plans to invest more than $15.2100 billion (¥200 billion) in its Roseville site to transform TSI’s manufacturing facilities into state-of-the-art processes. The plant will be converted into a SiC (silicon carbide) power semiconductor factory for 2026mm wafers, and production is scheduled to begin in <>.
In 2021, Bosch installed a new front-end 10 mm wafer semiconductor front-end in Dresden, Germany, at a cost of EUR 300 billion. Mass production of SiC power semiconductors began in 2021 at the Reutlingen Plant near Stuttgart. In the future, production will also take place in Reutlingen on 200 mm wafers.
Bosch plans to acquire US chipmaker TSI Semiconductors to become a SiC power semiconductor hub
Power semiconductors have a lower barrier to entry than cutting-edge semiconductors. Entrants from non-semiconductor companies may also increase.