The most advanced semiconductor process is the 5nm process, which is being mass-produced from 2020. This process is used for logic chips, but what is the latest process used in DRAM memory?
🟩The latest process of DRAM is “1α” nm
DRAM is a semiconductor that is mass-produced because it is used from servers to smartphones. In addition, DRAM is expected to be used in IoT devices such as automobiles in the future, but it is a field where the top three companies occupy 90% of the market share.
- DRAM market share
- No. 1 Samsung Electronics (Korea)
- No. 2 SK Hynix (Korea)
- No. 3 Micron Technology (U.S.)
Currently, the latest process of DRAM is the 10nm fourth-generation “1α” nm, which is being mass-produced from 2021. DRAM processes are being developed with the X-generation class of 10nm and below 20nm. Since the process technology is not unified among each company, it is expressed as a generation. “1α” nm is roughly 15 nm in the logic process.
- DRAM 10nm generation process
- 2016~ 1st generation 1x nm (19~18nm)
- 2017~ 2nd generation 1y nm (17~16nm)
- 2019~ 3rd generation 1z nm (16~15nm)
- 2021~ 4th generation 1α nm (15~14nm)
- 202x~ 5th generation 1β nm (?)
🟩 latest processes
From 2021, the fourth generation 10nm class DRAM production is produced using EUV equipment.
Production of 1α nm generation DRAM is scheduled to begin in the second half of 2021 using EUV.
Production of DRAM using the fourth-generation 10nm class process began in February 2021. However, Micron does not use EUV lithography. In addition, development for the practical application of the next generation of 1β nm is underway, and Micron’s base in Japan plays a central role.
The state-of-the-art process of DRAM is not a uniform standard among all companies in “1α” nm = about 15nm memory.
DRAM HAS BECOME AN OLIGOPOLY MARKET WITH 90% OF THE THREE MAJOR COMPANIES, AND SEMICONDUCTOR MANUFACTURING CONSIGNMENT LIKE TSMC IS NOT UTILIZED. AS A RESULT, MANUFACTURING HAS NOT BECOME AN INDUSTRY STANDARD.