ROHM and Infineon have announced a new collaboration to diversify procurement risk and meet growing demand by sharing SiC power semiconductor packaging.
🟧 ROHM and Infineon to standardize SiC power semiconductors
ROHM announced that it will collaborate with Infineon to jointly develop a compatible package for energy-saving silicon carbide (SiC) power semiconductors. This allows customers to source equivalent products from both companies, providing greater design freedom and supply stability.
- Key contents: Unified package specifications for some SiC products
- Technical Advantages: Reduced Design Burden, Procurement Risk Diversification, Improved Cooling Efficiency
- Target market: Growth areas such as electric vehicles (EVs) and AI data centers
On the technical side, Infineon’s top-side cooling packages (e.g. TOLT, Q-DPAK) and ROHM’s DOT-247 construction are noteworthy. They are effective in reducing thermal resistance and parasitic components, resulting in more efficient power conversion.
🟧 Supply Chain Diversification and Standardization Flows
The background is strong demand for geopolitical risks and supply chain diversification. Power semiconductors are strategic components that support the growth of EVs and AI servers, and stable supply determines corporate competitiveness.
Infineon has a global market share of about 20%, and ROHM has a deepening relationship with Denso, which is also noteworthy for its strong ties to the automotive industry. This initiative will promote industry-wide standardization, which may extend to GaN semiconductors in the future.
🟧Summary
ROHM and Infineon are trying to achieve customer procurement flexibility and efficiency at the same time through common packaging. The key to power semiconductors lies not only in chip performance but also in packaging technology, and this collaboration is a new step towards standardization.
SiC, which is expected to be a next-generation power semiconductor, has been developed by each company in its own package. If standardization moves like this one progress, it will lead to stability in procurement and ease of design, and will directly benefit users of the final product. At the same time, I feel that appropriate competition on the basis of standardization can be expected to further improve performance and reduce costs.
