Infineon’s large-scale European project, “Moore4Power,” is attracting attention not just as the development of next-generation power semiconductors, but as a strategic challenge for Europe’s leadership in power systems after the miniaturization limit.
🟧 Infineon launches next-generation power semiconductor ‘Moore4Power’ with 62 European organizations
Infineon Technologies, a leading German semiconductor company, has officially launched the research and development project “Moore4Power (More than Moore for Disruptive Innovations in Power Electronics),” involving 62 organizations from 15 European countries. The total budget is 91 million euros (about 17 billion yen) for a period of three years.
This project aims to realize high-efficiency next-generation power electronics by integrating different semiconductor materials such as Si, SiC, and GaN.
- Adopting the “More than Moore” philosophy, we shifted our strategy from the traditional “miniaturization competition” to “heterogeneous integration.”
- Utilizing power chiplet technology, we build modular power systems optimized for different applications.
- Targeting markets where power conversion efficiency is critical, such as EVs, wind power, railways, and industrial equipment.
What is particularly noteworthy is the system design philosophy of “placing the optimal material in the optimal place,” rather than aiming to improve performance with a single material. For example, by combining SiC, which excels at high voltage tolerance, GaN, which excels at high-speed switching, and low-cost Si, power losses can be significantly reduced.
Furthermore, by utilizing AI and digital twins, we aim to shorten the time from prototyping to datasheet completion from several weeks to “one week.”
🟧 Miniaturization Limits and the Power Crisis Accelerate the “Heterogeneous Integration” Competition
In today’s semiconductor industry, traditional miniaturization based on Moore’s Law is approaching physical and economic limits. Meanwhile, the spread of AI data centers, EVs, and renewable energy has rapidly increased the importance of power conversion efficiency. Especially in AI servers, not only computing performance but also “how efficiently power can be handled” has become a major competitive criterion.
Therefore, currently,
- Miniaturization-centered competition
- Standalone chip performance competition
From there,
- Integration of Heterogeneous Materials
- Package Integration
- System-wide optimization
The competitive axis is shifting toward this.
🟧 Conclusion
Infineon’s “Moore4Power” is not just research on next-generation power semiconductors, but a project that represents Europe’s industrial strategy for the “post-Moore era.” It includes numerous contents indicating the direction of next-generation power systems, including heterogeneous integration technologies that integrate Si, SiC, and GaN, power chiplets, and AI-based development.
Especially in the future, it seems that not only “who has the most advanced processes” but also “who can optimize power efficiency” will determine semiconductor competitiveness.
