From wafer to panel
🟦FOWLP and FOPLP the Evolution of Semiconductor Packaging
According to TrendForce, mass production of FOPLP is expected to begin in late 2024-2026 for consumer ICs and 2027-2028 for AI GPUs. FOPLP (Fan-Out Panel Level Package) technology is attracting attention as a next-generation semiconductor packaging technology because it costs less and the package size is larger than conventional packaging technology.
🟦 Toward miniaturization and cost reduction of semiconductors
In recent years, a technology called “FOWLP (Fan-Out Wafer Level Package)” has been attracting attention as an alternative to conventional wire bonding technology. FOWLP began commercial use with the A7 processor in the iPhone 10. FOWLP connects the chip to the redistribution layer at the wafer level to reduce size and cost.
A more advanced technology, FOPLP, connects the chips to the rewiring layer at a larger panel level, rather than the wafer. This makes it possible to make it even smaller and less costly than FOWLP, and it also gives you more freedom in chip placement.
🟦Summary
FOPLP also allows for smaller chip sizes, thinner packages, and improved performance. As a result, it is expected to play an important role in the development of the next generation of smartphones, computers, and other electronic devices.
FOPLP will be an important technology for the semiconductor industry in the future, as it will contribute not only to miniaturization and performance improvement, but also to solve the problem of semiconductor shortages.
