The rapid growth of generative AI is driving a surge in demand for advanced semiconductor manufacturing equipment, with 300mm fab capacity expected to reach record levels by 2028.
🟦Rapid growth of AI-driven 300mm fabs
From 2024 to 2028, 300mm fab production capacity is expected to grow at an average annual rate of 7%, reaching a record high of 11.1 million pieces per month by 2028, according to a new report released by SEMI. This is due to the growing demand for high-performance chips, especially generative AI.
- Led by advanced processes of 7nm and below, monthly production will increase by about 69% from 850,000 pieces in 2024 to 1.4 million pieces in 2028.
- Rapid progress is expected in cutting-edge nodes of 2 nm or less, with monthly production expected to grow from less than 200,000 units per month in 2025 to more than 500,000 units in 2028.
- Investment in advanced process equipment is also expected to grow at a CAGR of 18% per year, up from $26 billion in 2024 to more than $50 billion in 2028.
🟦 Behind this is AI and the growing demand for chips
Behind this growth is the exponential evolution of AI. Training large-scale AI models requires enormous computing power, which is not enough for conventional chips. In addition, emerging fields such as AI-based inference processing, personal assistants, VR/AR, and robotics are also demanding high-performance, power-saving semiconductors using advanced processes.
In response to this growing demand, there is an urgent need to respond to next-generation nodes such as 2nm and 1.4nm, and major foundry companies are accelerating the expansion of production capacity.
🟦 Summary
The AI-driven changes in the semiconductor market are manifesting in the form of large-scale expansions of 300mm fabs.
As investment in advanced nodes accelerates toward 2028, it will be a huge business opportunity for the entire ecosystem, including Japan companies.
