XPeng has launched its next-generation EV strategy with a view to “true Level 3” with local computing at 2200 TOPS by installing its own AI semiconductor “Zurei” in the new G7 Ultra SUV for the first time.
全球首款L3级算力AI汽车! 小鹏G7公式亮相,预售价235,800-小鹏汽车官网
🟦 Introducing the Xiaopeng G7 — In-house “Figure” AI chip
The Xianpeng G7 Ultra is equipped with three “Zurei” chips with a 40-core CPU + dual NPU, achieving a total of 2200 TOPS of computing performance. This is 3~4 times more than mainstream SoCs, and can instantly inferce in-vehicle AI models (up to 30 billion parameters) without communication. In other words, for beginners, it is an image of the car itself acquiring a “brain that thinks and makes decisions” without relying on the cloud.
🟦 Why Proprietary AI Chips: The Trend of Self-Sufficiency Promoted by De-Cloud Computing and Intensifying Competition
In the Chinese EV market, competition for large-capacity AI computing, including Tesla and NIO, is intensifying. Communication delays and regulatory risks were unavoidable when relying on the cloud, so Xiaopeng chose a strategy of “everything is done in the car.” With our own chips, we are able to achieve both software optimization and cost reduction, and we are also considering supplying them to Volkswagen vehicles in the future.
🟦 Summary
The biggest topic of the Xianpeng G7 Ultra is that it has achieved high-performance AI that does not require the cloud with a 2200 TOPS Trimage chip, and has set the stage for Level 3 practical application.
The history of semiconductors has alternated between “generalization” and “specialization”. As we enter the age of AI, and the demand for computational processing and real-time performance increases rapidly, “specialization” is accelerating again. The approach of vertically integrating complex needs that cannot be fully optimized with general-purpose SoCs with in-house chips will hold the key to the future competition for autonomous driving and smart mobility.
