Infineon signs new multi-year supply agreement with Resonac for SiC materials for SiC power semiconductors
🟦 Infineon renews SiC supply agreement
Power semiconductor leader Infineon Technology has signed a new multi-year supply cooperation agreement with Resonac (formerly Showa Denko) for materials used in SiC power semiconductors. The terms of the agreement signed in 2021 will complement and expand the two-year sales and joint development agreement.
It was established in January 2023 as a new integrated company between Showa Denko and the former Hitachi Chemical. IT IS A COINED WORD THAT COMBINES THE INITIAL C OF “RESONATE”, WHICH MEANS RESONANCE OR RESONANCE IN ENGLISH, AND “CHEMISTRY”, WHICH MEANS CHEMISTRY. Resonac has strengths in manufacturing epitaxial wafers, power semiconductor components using silicon carbide (SiC) compounds. We are also involved in the domestic production of substrates used as raw materials, and our global market share accounts for 1%.
🟦Long-term procurement contract trends for SiC substrates
Resonac supplies Infineon with 150 mm SiC material. In 2025, we will also start mass production of SiC substrates that are as large as 8 mm, which is nearly 200% larger. As a result, we plan to increase the production of SiC epitaxial wafers to about five times the current production volume by 2026. Long-term contracts for external procurement of SiC substrates by semiconductor manufacturers are becoming a trend.
- ← Resonac, Wolfspeed, II-VI (Two Six)
- ← Wolfspeed, Rome (Cycrystal)
- ← Resonac
- ← Resonac
Following the trend of long-term supply agreements between leading semiconductor manufacturers and SiC material manufacturers, Infineon signs new multi-year supply cooperation agreement with Resonac for SiC materials for SiC power semiconductors
With the trend of EV shifting, the boom in SiC power semiconductors is likely to continue.